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Experimental up-scaling of thermal conductivity reductions in silicon by vacancy-engineering: From the nano-To the micro-scale

  • Neil M. Wight
  • , Nick S. Bennett

Resultado de pesquisa: Conference articlerevisão de pares

Resumo

A method to reduce the thermal conductivity in Si thin-films by at least an order of magnitude is shown, successfully demonstrating the up-scaling of this technique from Si nano-films. High energy self implantation of Si is used to create a supersaturation of lattice vacancy concentrations that remain following post implant rapid thermal annealing producing a disruption in phonon mode thermal transport. This method demonstrates an approach for micro-harvesting thermoelectric device applications without the difficulties faced for dimensional up-scaling in alternative Si thermoelectric approaches. Challenges surrounding the thermal budget required for post implant dopant activation in p-Type Si are also shown.

Idioma originalEnglish
Páginas (de-até)10211-10217
Número de páginas7
RevistaMaterials Today: Proceedings
Volume5
Número de emissão4 (1)
DOIs
Estado da publicaçãoPublished - 22 mai. 2018
Evento14th European Conference on Thermoelectrics, ECT2016 - Lisbon, Portugal
Duração: 20 set. 201623 set. 2016

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