TY - GEN
T1 - Stress of homogeneous and graded epitaxial thin films studied by full-shape analysis of high resolution reciprocal space maps
AU - Ulyanenkova, Tatjana
AU - Benediktovitch, Andrei
AU - Myronov, Maksym
AU - Halpin, John
AU - Rhead, Stephen
AU - Ulyanenkov, Alex
N1 - Copyright unknown. The author was not affiliated to SAMS at the time of publication.
PY - 2013/9/1
Y1 - 2013/9/1
N2 - The Bragg peak position of a homogeneous solid solution epitaxial film is directly related to the solid solution concentration, film strain and, consequently, residual stress. The peak shape contains information about defects present in the sample. In the case of compositionally graded epitaxial films the situation is more complex since instead of a single Bragg peak there is a continuous diffracted intensity distribution which can be measured by means of recording high resolution reciprocal space maps. We analyse the thin film residual stress based not only on peak positions, but taking into account the defect-induced peak shape as well. Consideration of the peak shape enables the determination of the stress depth profile in the case of graded films and to improves the accuracy in the case of homogeneous films.
AB - The Bragg peak position of a homogeneous solid solution epitaxial film is directly related to the solid solution concentration, film strain and, consequently, residual stress. The peak shape contains information about defects present in the sample. In the case of compositionally graded epitaxial films the situation is more complex since instead of a single Bragg peak there is a continuous diffracted intensity distribution which can be measured by means of recording high resolution reciprocal space maps. We analyse the thin film residual stress based not only on peak positions, but taking into account the defect-induced peak shape as well. Consideration of the peak shape enables the determination of the stress depth profile in the case of graded films and to improves the accuracy in the case of homogeneous films.
KW - High resolution X-ray diffraction
KW - Misfit dislocations
KW - Reciprocal space mapping
KW - Stress and composition depth profiles
KW - Stress and composition value
UR - http://www.scopus.com/inward/record.url?scp=84886010952&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84886010952&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.768-769.249
DO - 10.4028/www.scientific.net/MSF.768-769.249
M3 - Conference contribution
AN - SCOPUS:84886010952
SN - 9783037858493
T3 - Materials Science Forum
SP - 249
EP - 256
BT - International Conference on Residual Stresses 9 (ICRS 9)
PB - Trans Tech Publications Ltd
T2 - 9th International Conference on Residual Stresses, ICRS 2012
Y2 - 7 October 2012 through 9 October 2012
ER -