Experimental up-scaling of thermal conductivity reductions in silicon by vacancy-engineering: From the nano-To the micro-scale

Neil M. Wight, Nick S. Bennett

Research output: Contribution to journalConference articlepeer-review

Abstract

A method to reduce the thermal conductivity in Si thin-films by at least an order of magnitude is shown, successfully demonstrating the up-scaling of this technique from Si nano-films. High energy self implantation of Si is used to create a supersaturation of lattice vacancy concentrations that remain following post implant rapid thermal annealing producing a disruption in phonon mode thermal transport. This method demonstrates an approach for micro-harvesting thermoelectric device applications without the difficulties faced for dimensional up-scaling in alternative Si thermoelectric approaches. Challenges surrounding the thermal budget required for post implant dopant activation in p-Type Si are also shown.

Original languageEnglish
Pages (from-to)10211-10217
Number of pages7
JournalMaterials Today: Proceedings
Volume5
Issue number4 (1)
DOIs
Publication statusPublished - 22 May 2018
Event14th European Conference on Thermoelectrics, ECT2016 - Lisbon, Portugal
Duration: 20 Sept 201623 Sept 2016

Keywords

  • Silicon
  • Thermal conductivity
  • Thermoelectric
  • Thin-film
  • Vacancy

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