TY - JOUR
T1 - Experimental up-scaling of thermal conductivity reductions in silicon by vacancy-engineering
T2 - 14th European Conference on Thermoelectrics, ECT2016
AU - Wight, Neil M.
AU - Bennett, Nick S.
N1 - © 2017 Elsevier Ltd. All rights reserved.
PY - 2018/5/22
Y1 - 2018/5/22
N2 - A method to reduce the thermal conductivity in Si thin-films by at least an order of magnitude is shown, successfully demonstrating the up-scaling of this technique from Si nano-films. High energy self implantation of Si is used to create a supersaturation of lattice vacancy concentrations that remain following post implant rapid thermal annealing producing a disruption in phonon mode thermal transport. This method demonstrates an approach for micro-harvesting thermoelectric device applications without the difficulties faced for dimensional up-scaling in alternative Si thermoelectric approaches. Challenges surrounding the thermal budget required for post implant dopant activation in p-Type Si are also shown.
AB - A method to reduce the thermal conductivity in Si thin-films by at least an order of magnitude is shown, successfully demonstrating the up-scaling of this technique from Si nano-films. High energy self implantation of Si is used to create a supersaturation of lattice vacancy concentrations that remain following post implant rapid thermal annealing producing a disruption in phonon mode thermal transport. This method demonstrates an approach for micro-harvesting thermoelectric device applications without the difficulties faced for dimensional up-scaling in alternative Si thermoelectric approaches. Challenges surrounding the thermal budget required for post implant dopant activation in p-Type Si are also shown.
KW - Silicon
KW - Thermal conductivity
KW - Thermoelectric
KW - Thin-film
KW - Vacancy
UR - http://www.scopus.com/inward/record.url?scp=85053814022&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85053814022&partnerID=8YFLogxK
U2 - 10.1016/j.matpr.2017.12.267
DO - 10.1016/j.matpr.2017.12.267
M3 - Conference article
AN - SCOPUS:85053814022
VL - 5
SP - 10211
EP - 10217
JO - Materials Today: Proceedings
JF - Materials Today: Proceedings
IS - 4 (1)
Y2 - 20 September 2016 through 23 September 2016
ER -