Experimental up-scaling of thermal conductivity reductions in silicon by vacancy-engineering: From the nano-To the micro-scale

  • Neil M. Wight
  • , Nick S. Bennett

Publikation: Conference articleBegutachtung

Fingerprint

Untersuchen Sie die Forschungsthemen von „Experimental up-scaling of thermal conductivity reductions in silicon by vacancy-engineering: From the nano-To the micro-scale“. Zusammen bilden sie einen einzigartigen Fingerprint.
sortieren

Material Science